“Co Liner Impact on Microstructure of Cu Interconnects.” ECS Journal of Solid State Science and Technology, vol. 4, no. 1, pp. N3177–79 by emc32-adm | Jan 1, 2015 | 0 comments Submit a Comment Cancel replyYour email address will not be published. Required fields are marked *Comment * Name * Email * Website Save my name, email, and website in this browser for the next time I comment.