“Dealing With Multiple Grains in TEM Lamellae Thickness for Microstructure Analysis Using Scanning Precession Electron Diffraction.” Microscopy and Microanalysis, vol. 21, no. S3, pp. 1243–44 by emc32-adm | Jan 1, 2015 | 0 comments Submit a Comment Cancel replyYour email address will not be published. Required fields are marked *Comment * Name * Email * Website Save my name, email, and website in this browser for the next time I comment.