“Grain Structure Analysis and Effect on Electromigration Reliability in Nanoscale Cu Interconnects.” Applied Physics Letters, vol. 102, no. 13, pp. 1–5 by emc32-adm | Jan 1, 2013 | 0 comments Submit a Comment Cancel replyYour email address will not be published. Required fields are marked *Comment * Name * Email * Website Save my name, email, and website in this browser for the next time I comment.