"Microstructural Void Environment Characterization by Electron Imaging in 45 Nm Technology Node to Link Electromigration and Copper Microstructure." Microelectronic Engineering, vol. 106, Elsevier B.V., pp. 168–71

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“Microstructural Void Environment Characterization by Electron Imaging in 45 Nm Technology Node to Link Electromigration and Copper Microstructure.” Microelectronic Engineering, vol. 106, Elsevier B.V., pp. 168–71