“Pattern Size Dependence of Grain Growth in Cu Interconnects.” Scripta Materialia, vol. 63, no. 10, pp. 965–68 by emc32-adm | Jan 1, 2010 | 0 comments Submit a Comment Cancel replyYour email address will not be published. Required fields are marked *Comment * Name * Email * Website Save my name, email, and website in this browser for the next time I comment.