Scanned acquisition with precession electron diffraction

Topspin is a digital STEM, Beam Precession and Analytical Experiment Framework that offers a suite of beam precession-enabled imaging and advanced analytical experiments

Using Digistar this system can collect precession electron diffraction (PED) patterns for each point in a scanned image.

Topspin allows researchers to routinely perform advanced analytical experiments inside an Electron Microscope in ways previously not possible.

The Topspin framework enhances TEM capabilities in several key areas:

  • Digital TEM and STEM imaging
  • Phase and orientation mapping (ASTAR)
  • Strain mapping analysis
  • Enhanced EDX and EELS spectroscopy
  • Model-based EELS quantification

4D-STEM with Topspin PED Acquisition software*

  • Synchronized beam scanning and precession with multi-signal data acquisition
  • Advanced control of DigiSTAR and external optical CCD camera
  • Virtual STEM imaging with beam precession control. Virtual reference STEM image providing accurate control of scanned region. Mapping of site specific regions possible with precise positioning of region of interest, using multiple scan modes (spot, line, area)
  • Virtual BF/DF via external optical CCD
  • On-line distortion correction of CCD camera images
  • Specific software module that allows data acquisition with high sensitivity/speed from Direct  electron detectors. Data can be used with ASTAR or STRAIN.
  • Drift correction available as a reference image is acquired before scanning. Drift correction window is tracked during acquisition
  • Calibration of rotation between virtual STEM images and acquired diffraction patterns is automatically exported with ASTAR *.blo files
  • Full 14-bit dynamic range of acquired diffraction patterns is retained in database files. Intensity scaling (brightness/contrast/gamma) for *.blo files can be readjusted after acquisition

 * needs DigiSTAR




    • Completely automated simultaneous adjustment of 64 compensation points for best possible spatial resolution. Additional compensation points can be added as needed
    • 16 bit images used for alignment
    • Sub-pixel alignment accuracy at 580×580 camera resolution performed by looking at the image of the probe in order to provide correct pivot point adjustment, even at large precession angles



    • Enhanced nanobeam  diffraction resolves strain at the nanometer scale
    • Acquisition of virtual STEM reference image
    • Ultra-fast nanobeam precession electron diffraction scanned acquisition
    • Automated local strain analysis via proprietary algorithm
    • Optimized data for FinFET analysis
    • Spatial resolution  < 2 nm attainable (FEG TEM)
    • Strain sensitivity < 2 x 10-4 (FEG  TEM)